Packaging and Integration
Cordon Electronics Italia offers Microwave Chip&Wire packaging and integration services in clean room facility, providing turnkey solutions from components to sub-systems, to satisfy Customer demands of samples, pre-series and production.
Assembly and testing operations are performed in a 900 sqm ISO 8 clean room facility and in a 900 sqm ESD production area:
- Processes for adhesive and solder paste dispensing
- Components placement process (MMICs)
- Connection equipments (wire and ribbon bonding)
- Subsystem integration
- MW tests and ESS
- Qualification tests
